High-precision punching and laminating processing of insulating films and tapes.
Leave the punching and laminating of polyimide tapes like Kapton, as well as resin films such as PET and PP, to Otis.
Devices that operate on electricity require insulation measures. Resin materials used for insulation measures include PI (polyimide), PEN, and PPS, among others. Among these, PI is particularly notable for its excellent properties such as high heat resistance, low thermal expansion rate, dielectric strength, and chemical resistance. It is used in many products, including FPC (flexible printed circuit boards), heat-resistant masking tape, release materials for heat press machines, semiconductor manufacturing processes, and connectors. At Otis, we primarily perform die-cutting and laminating processes for films and adhesive tapes aimed at electronic products, and we have a wealth of experience in processing PI (polyimide) films. Through our unique development equipment and process design, we contribute to enhancing the added value of products by not only achieving high-precision die-cutting of single materials but also by laminating different materials together. You can trust us with lamination processing involving metal foils, foam materials, conductive tapes, heat-adhesive films, and more. We are also taking on challenges in small-diameter processing, narrow-width die-cutting, and fine shapes. If you have any issues with tape or film (sheet) die-cutting, please consult with Otis.
- 企業：オーティス
- 価格：Other
